POWER SEMICONDUCTOR DEVICES
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Data
Sheet
Part
Number
Weight (without current lead) Screw hole diameter (Diameter of the contact surface) Overall dimensions without current lead (width/length/height Heat resistance (Dissipation capacity) natural cooling Heat resistance Air speed is 6 m/sec Pressure Differential
[g][mm][mm][C/W (W)][C/W][Pa]
O171 0.669 (0.63)M20x1.570x80x1001.120 (80)0.35518
O271 1.539 (1.5)M20x1.5110x110x1000.710 (130)0.23625
O371 0.404 (0.365)M20x1.545X80X801.900 (50)0.67015
O181 0.672 (0.62)M24x1.570x80x1001.120 (80)0.35518
O281 1.542 (1.49)M24x1.5110x110x1000.710 (130)0.23625
O123 1.58 (1.45)(22)126X100X1220.710 (120)0.21220
O143 3.18 (2.85)(42)135X150X1250.500 (120)0.12530
O243 5.56 (4.76)(42)170X150X1700.280 (220)0.08030
O343 5.26 (4.46)(42)170X150X1500.355 (220)0.10030
O153 5.57 (4.77)(55)170X150X1760.280 (220)0.07530
O253 5.27 (4.47)(55)170X150X1560.355 (220)0.10030
O173 12.18 (10.57)(82)200X250X2100.180 (400)0.05040
O193 22.9 (22.0)100300x300x2130.101 (400)0.0329

Part numbering guide

271 - 110 - N
1 2   3   4

 

1. — Heatsink
2. Design version
3. Length, mm
5. Ambient conditions