POWER SEMICONDUCTOR DEVICES
ENG
Your cart | goods: 0
Find product / service

You don't select value

Product/Process Change Notifications

PCN PP.8.33.01 of 29.01.2015     Adding of barcode to labeling of capsule devices. Placing of additional label on internal packaging of capsule devices.

Following changes introduced:

  • Barcode is added to labeling.
  • Additionally, label is placed on the left butt end of the box, showing individual linear barcode of each device with serial number, part number, production lot number and amount of devices inside the box. 

PCN S.8.34.01 of 29.01.2015       Adding of barcode to labeling of stud devices. Putting of labeling on ceramic areas of stud devices. Placing of additional label on internal packaging of stud devices.

  • Barcode is added to labeling.
  • Labeling is located on the ceramic area of housing instead of the metal area.
  • Additionally, label is placed on the left butt end of the box, showing individual linear barcode of each device with serial number, part number, production lot number and amount of devices inside the box. 

PCN M.8.32.01 of 29.01.2015       Placing of additional label on internal packaging of modules.

  • Additionally, label is placed on the left butt end of the box, showing individual linear barcode of each device with serial number, part number, production lot number and amount of devices inside the box.

PCN M1.31.01  of 26.12.2014       Phasing out of M.C modules. Replacement of M.C modules with M.C1 modules

  • . module has been redesigned to comply with overall and port sizes of European analogues.
  • Design has been improved, placement of semiconductor die has been changed thus increasing insulation and lowering thermal resistance.
  • Basic electrical characteristics have been improved.
  • Product range of .1 module has been extended compared to . module.

Back